Electronics Manufacturing Services

Komoline offers Special Electronics Manufacturing Services having demand of following Hi-Reliability applications.

1. Spark 400 Selective Assembly System

Automated Selective assembly of through-hole components and SMT
Missing (Planned or Unplanned) Components Assembly on populated boards
Mass automated rework
Swapping of Components for fine tuning applications
Phase by Phase partial assembling for sub section performance testing
Sensors and Moisture-sensitive Components
Optical surface mount components
On the fly Pb and Pb-free mix soldering
Soldering of RF, Microwave odd shaped components including shields
Strong intermettalic joints < 1 μ with zero defect soldering compared to 500 μ with any other conventional soldering process
Components and pins wise individual thermal Profiling with graphs
Extremely controlled solder quantities per joint
Totally safe for delicate components and PCB boards for multiple reworks
Absolutely ESD/EMI/EMC safe assembly process
No Thermal shocks to any components. Just 50°C of soldered component with Pin soldering temperature of 220°C
Class 10,000 Clean-room facilities
Environmental controlled production area
ESD Safe infrastructure, process and consumables
Qualified and trained manpower for zero-defect soldering
Zero Setup time including Shortest turn around time

2. Spark 100 Selective Laser Soldering

Single Prototypes and Pilot Production lots are also automated assembled including automated Inspection having vision capability using matrix algorithms
Large Ground planes and Thermal planes via fill up with no thermal stress on Multilayer boards
Automated work/rework for ceramic fine-pitch packages and BGA, CSP, Flip-Chip, Wafer Scale packages, Bare Dies including re-balling of BGA
Automated Dam and Fill for vibration and bump tests
Environmental testing of assemblies
MIS management software for planning and traceability
Non Contact Soldering Process by Laser
Double side component placement with heavy components also on bottom side.
3s Process accuracy
Automated & Manual programming using CAD & BOM Files
Process and joint wise history sheet management and report generation
Single process for Board Loading, Baking, epoxy dispensing, solder dispensing, fluxing, component placement and soldering with concurrent automated inspection of conventional and odd shaped custom components
Quick Turn Prototype Assembly
Pilot and Small Lot Production
MeMs Based Sensors soldering
High Volume Specialized Applications
- Selective Assembly of Planned (and Un-Planned) Missing SMT Components
- Selective Assembly of:
  - SMT Connectors (Single and Double Sided)
  - RF Shields
  - Through Hole Components (Paste in Hole Process)
  - Heat Sensitive Components
  - Optical Components & Smart Cards - Moisture Sensitive Components
  - Lead-Free High Temperature Soldering
- Automated Mass Rework, Including BGAs
- Re-balling all Types of BGA
- Heavy Bottom Side Components Applications
- Flip-Chip & CSP Assembly
- Unique & Special Applications
Extremely tight integration upto 15 mil spacing work and rework

KEPL automated laser assembly process has ability to selectively assemble any component addresses these technical issues.

	ASIC Tester

	SMT Movies

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